Submit your abstract under the session Device Fabrication for Material Science Congress.
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically the metal-oxide-semiconductor (MOS) devices used in the integrated circuit (IC) chips that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps (such as surface passivation, thermal oxidation and p–n junction isolation) during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
For more: http://www.globalepisteme.org/Conference/material-science-conference
To register: http://globalepisteme.org/Conference/material-science-conference/registration
Submit your abstract: http://globalepisteme.org/Conference/material-science-conference/submitabstract
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically the metal-oxide-semiconductor (MOS) devices used in the integrated circuit (IC) chips that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps (such as surface passivation, thermal oxidation and p–n junction isolation) during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
For more: http://www.globalepisteme.org/Conference/material-science-conference
To register: http://globalepisteme.org/Conference/material-science-conference/registration
Submit your abstract: http://globalepisteme.org/Conference/material-science-conference/submitabstract
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